NANO-MASTER Plasma Ashing and Cleaning Systems are designed to meet a wide range of needs from wafer resist stripping to surface modification of batch as single wafer loads. They are PC controlled systems with various plasma sources, heated and unheated substrate holders and unique ability to switch from plasma etch to RIE etch modes.

 Features:

• Table Top or Stand Alone System

• Stainless Steel, Aluminum or Bell Jar Chambers

• Class 100 Clean Room Compatible

• Shower Head, ICP or Microwave Plasma Sources

• Rotating Platen

• RF Biasable Heated up to 300 °C PID Controlled or Cooled Platen

• Fully Automated or Manual RF tuning

• Up to 4 Mass Flow Controllers with Electropolished Gas Lines

• PC Controlled Pneumatic Valves

• Multiple Levels of Access with Password Protection

• PC Controlled with LabVIEW

• Mechanical Pump with Pressure goes to 10 mTorr

• 250 l/sec Turbomolecular Pump

• 5x10-7 Torr Base Pressure

• Fully Safety Interlocked 

Applications:

• Removal of Organic and Inorganic Materials without Residues

• Photoresist Stripping or Ashing

• Desmearing and Etch Back Applications

• Cleaning Microelectronics, Drilled Holes on Circuit Boards or Cu Lead Frames

• Adhesion Promotion, Elimination of Bonding Problems

• Surface Modification of Plastics: O2 Treatment for Paintability