Wafer/Mask Cleaners

Sputtering Systems

Etching Systems

PECVD Systems

Thermal Evaporators

Heated Platens

Ultra-Pure Processing

Plasma Processing

Pulsed DC Controllers

Optical Sensors

Capacitve Sensors

CLEARANCE

Plasma Consult Plasma Sources

 

hcdl300.jpg (12548 bytes)

HCD-L 300 (linear)

P-100.jpg (221120 bytes)

HCD-P 100 (planar type)

 Hollow Cathode 13.56 MHz RF Plasma Sources
Operation over an extended power and pressure range
High plasma and radical species densities with excellent homogenity (1011 cm-3)
Compatible with chemical reactive and non-reactive gases
Cw and pulsed power operation
Low contamination
Linear type also available in 600 mm and 900 mm
Applications:
Plasma enhanced chemical vapor deposition (PECVD)
Plasma polymerization, plasma cleaning, plasma etching
Surface modification
slan.jpg (16715 bytes)

SLAN Series (available in 4, 16 and 67 cm diameters)

 
SLAN (SLot ANtenna) 2.45 GHz Microwave Plasma Sources
High plasma densities
Pressure range from 10-5 mbar up to atmospheric pressure
Compatible with chemically reactive and non-reactive gases
Low contamination
ECR and non-ECR operation
Cw and pulsed operation
Available in 4, 16 and 67 cm diameters
Applications:
Plasma enhanced chemical vapor deposition (PECVD)
Plasma polymerization, plasma cleaning, plasma etching
Surface modification
Material science
 
ICP.jpg (32996 bytes)

ICP-P 200

Inductively Coupled Plasma Source ICP-P 200 (13.56 MHz)
Planar coil with 200 mm diameter
Extended power range (3-1200 W)
Low ion energy with narrow energy spread
High plasma and radical densities
Low contamination
Cw and pulsed operation
Applications:
Plasma enhanced chemical vapor deposition (PECVD)
Plasma polymerization, plasma cleaning, plasma etching
Surface modification
Material science