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NANO-MASTER
state-of-the-art Sputtering Systems come with water cooled rotating 8”
platen and up to three off-axis planar magnetrons. The system is pumped
with a turbomolecular pump and achieves low 10-6 Torr within
15 minutes. RF or DC power is applied to the individual magnetron
through an RF switch. Magnetron to substrate distance is adjustable in
order to achieve desired uniformity and deposition rate. Rotating platen
with off axis magnetrons provide means of achieving the best film
uniformity. Crystal thickness monitor is provided for terminating
process automatically.
Features:
• Stainless
Steel, Aluminum or Bell Jar chambers
• 70, 250 or
500 l/sec turbomolecular pump backed with a mechanical or dry pump
• 13.5 MHz,
300-600 W RF and 1KW DC power supplies
• Crystal
holder with <1 Å thickness resolution
• Door with
view port for easy wafer load and unload
• PC
Controlled with LabVIEW
• Multiple
levels of access with password protection
• Fully
safety interlocked
Options:
• Up, Down
and Side Sputtering
• RF, DC and
Pulsed DC Sputtering
•
Co-Sputtering, Reactive Sputtering
•
Combinatorial Sputtering
• RF or DC
bias (1000 V)
• Heated
Platen up to 700 °C
• Thickness
Monitor
• Substrate
RF Plasma Cleaning
• Load Lock
and Auto Wafer Load Unload
Applications:
• Metal and
dielectric coating of wafers, ceramics, glass blanks and disk heads
• Optical and
ITO coatings
• Hard
coatings with high temperature platens and Pulsed DC power supplies
• Reactive
sputtering with RF plasma discharge
Models:
NSC-4000
PC Controlled, Stand Alone System
NSC-3500
PC Controlled, Compact Stand Alone System
NSC-3000
PC Controlled, Table Top
Dual
Systems
NSR-4000
Sputtering and RIE System
NSP-4000
Sputtering and PECVD System
NST-4000
Sputtering and Thermal Evaporator System |
