MEGASONIC SINGLE WAFER AND MASK

MEGASONIC SINGLE WAFER AND MASK CLEANERS

SWC-4000

SWC-3000

LSC-4000

High Speed Brush

Cleaning and Processing Technology

Nano-Master Megasonic Single Wafer and Mask Cleaners provide reproducible, uniform and state-of-art megasonic cleaning. It incorporates patented damage free megasonic cleaning, chemical cleaning, brush cleaning and drying in one process step.

To achieve maximum cleaning optimization without substrate damage, the megasonic energy density must be kept slightly below the damage threshold at any point on the sample. NANO-MASTER’s patented technology assures uniform distribution of the acoustic energy across the entire surface of the substrate allowing ideal cleaning by maximizing the distributed energy while staying below the sample’s damage threshold.

Depending on the application, certain options will further enhance the tool’s ability to remove unwanted particles and residues

Applications

Cleaning

• Wafers

• Saphire Wafers

• Chips on Wafer Frame

• Display Panels

• ITO Coated Displays

• Patterned and Un-patterned Masks

• Mask Blanks

• Pelliclized Masks

• Contact Masks

Photoresist Processing

• Piranha Stripping

• Resist Coating

• Resist Lift-Off

Etching

• Metal Etching of Al, Au, Cr, Ti

Piranha Cleaning

•H₂SO₄ and H₂O₂ Dispensed and

Mixed on the Wafer

• IR Heating

• Brush Clean

• Megasonic DI Water Clean

• Heated N₂ and Spin Dry

Features:

• 21” OD, 15”x15” Substrates

• Large Environmental Chamber with Megasonic

DI, Brush, Hot DI, High Pressure DI, Heated N₂,

Chemical Dispense Arm

• Variable Speed Brush with Chemical Dispense

• Touchscreen User Interface

• Manual Load and Unload

• Safety Interlocks and Alarm

• 30”D x 26”W Footprint

Options:

• Chemical Delivery Module

• Piranha Cleaning

• Ozone Generator

• Hydrogenated DI Water Generator

• High Pressure DI Module

• Sulphuric Acid Hydrogen Peroxide

• IR Heating

• DI Water Recirculator

• Robotic Load Unload Module

•Cluster System with EFEM and SMIF interface

Resist Stripping / Lift Off

• NMP Dispense with IR Heating

• Brush Clean

• Megasonic DI Water Clean

• Heated N₂ and Spin Dry

CMP Wafer Cleaning

• Removes CMP Particles with Brush and Megasonic DI Cleaning

• Chemical Dispense Arm

• Chemical Dispense Canisters

• Special Chucks for Front Side and Back Side Brush Cleaning

• Variable Speed PVA Brush

• Adjustable Brush/Wafer Contact Pressure

• Chemical Dispense Through Brush

Pelliclized/Unpelliclized Mask Cleaning

• Full Cleaning without Necessity of Pellicle Replacement

• Pellicle is Fully Protected

• Pelliclized Mask Cleaning Process:

1) Back Side of the Mask is Cleaned

Megasonic DI Clean
Brush Clean
Chemical Clean
Heated N₂ Spin Dry

2) Heated N₂ Spin Dry