Single Wafer and Mask Cleaners

MEGASONIC SINGLE WAFER and MASK CLEANERS

SWC-4000

Damage-free Megasonic and Chemical Cleaning

APPLICATIONS:

Patterned or Un-patterned Wafer Cleaning
Ge, GaAs and InP Wafer Cleaning
Post CMP Wafer Cleaning
Cleaning of the Diced Chips on Wafer Frame
Cleaning after Plasma Etching or Photoresist Stripping
Cleaning after Lapping and prior to Bonding
Cleaning of X-ray Masks, EUV Masks, Templates
Pelliclized Reticle Cleaning
Cleaning of Mask Blanks
Cleaning Contact Masks
Cleaning of the ITO coated Display Panels
Cleaning of Ceramic Substrates w/ laser drilled holes
Optical Lens Cleaning
Megasonic agitation to enhance Lift-off Process

MODELS:

SWC-3000	Standard Table-top Model	Megasonic Cleaning Spin Dry with N₂
SWC-3000-C	Table-top with CDU	Megasonic Cleaning Spin Dry with N₂Chemical Dispense Capability
SWC-3000-M	Table-top for mask cleaning	Megasonic Cleaning Spin Dry with N₂/IR Lamp dry
SWC-4000	Standard Stand-alone model	Megasonic Cleaning Spin Dry with Heated N₂Chemical Dispense, Acid&Solvent Separate Drain
SWC-4000-M	Stand-alone Mask Cleaner	Megasonic Cleaning Spin Dry with Heated N₂Chemical Dispense, Acid&Solvent Separate Drain
SWC-4000-MP	Pelliclized Reticle Cleaner	Megasonic Cleaning Spin Dry with Heated N₂Chemical Dispense, Acid&Solvent Separate Drain

ADDITIONAL OPTIONS:

Brush Cleaning
Ozonated DI Water (20 ppm)
Hot DI Water Flush
Heated Nitrogen
Nitrogen Ionizer

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SWC-3000

Outline:

NANO-MASTER offers Megasonic Single Wafer & Mask Cleaning Systems for the state of the art damage-free megasonic cleaning of substrates with the highest resolution patterns by controlling uniform distribution of the acoustic energy density across the entire surface of the substrate. Particle release off the surface is enhanced with chemical dispense and then the released particles are removed from the substrate surface allowing the least number of reattachments by sweeping off with the radial flow of the DI water. This patented technology provides reproducible and uniform cleaning of the wafers, masks, and other delicate substrates with maximum megasonic energy just below the damage threshold of parts to be cleaned.

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